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FLUX LED SPECIFICATION
980PG0C
Fatures
Single color High bright output High Current Operation Low power consumption High reliability and long life
? 3.0 0.2
CATHODE
1.5mm
Descriptions
Dice material Emitting ColorAqua Green Device Outline7.6mmX7.6mm Lens TypeWater Clear
NOTE:
All dimensions are millimetres. Tolerance is +/-0.25mm unless otherivise
DIRECTIVITY Relative Luminous Intensity
1.0 0 Ta=25 C IF=20mA 30
0.5
60
0
90
60
30
0
0.5
90 1.0
Radiation Angle
Page: 1
LED SPECIFICATION
Absolute maximum ratingsTa = 25
Parameter Reverse Voltage Forward Current Power Dissipation Pulse Current Operating Temperature Storage Temperature Symbol VR IF Pd Ipeak Topr Tstr Test Condition Value Min. 5 ----------40 -40 Max. -30 75 100 +85 +100 Unit V mA mW mA
IR = 30A ------Duty=0.1mS1kHz -------
Electrical and optical characteristics Ta = 25
Parameter Forward Voltage Reverse Current Dominate Wavelength Spectral Line half-width Luminous Flux Viewing Angle Symbol VF IR d IV 21/2 Test Condition IF = 50mA VR = 5V IF = 50mA IF = 50mA IF = 50mA IF = 50mA 70 ---Value Min. Typ. V9~V11 ---G3~G5 20 G,H 80 Deg. nm 30 A Max. Unit
Page: 2
FLUX BIN FOR PIRANHA (UFO) LEDS
Bin Code A B C D LM <=0.46 0.46-0.60 0.60-0.77 0.77-1.0 Bin Code E F G H LM 1.0-1.3 1.3-1.7 1.7-2.2 2.2-2.8 Bin Code J K L M LM 2.8-3.6 3.6-4.7 4.7-6.0 6.0-7.8 Bin Code N P Q R LM 7.8-10.0 10-13 13-17 17-22
WAVELENGTH BIN
Ligth Col. Bin Code Wavel. (nm) Ligth Col. Bin Code Wavel. (nm) B1 BLUE B2 B3 B4 B5 B6 G1 G2 BLUE GREEN G3 G4 G5 G6 G7 G8 G9 G10 G11 G12 PURE GREEN G13 G14 G15 G16 G17 G18 G19 Bin Code V1 V2 V3 V4 VF (V) 1.6-1.8 1.8-2.0 2.0-2.2 2.2-2.4 450-455 455-460 460-465 465-470 470-475 475-480 491-494 494-497 497-500 500-503 503-506 506-509 509-512 512-515 515-518 518-521 521-524 524-527 527-530 530-533 533-536 536-539 539-542 542-545 545-548 Bin Code V5 V6 V7 V8 VF (V) 2.4-2.6 2.6-2.8 2.8-3.0 3.0-3.2 RED PURE ORANGE YELLOW ORANGE YELLOW YG1 YG2 YG3 YG4 YG5 YG6 YG7 Y1 Y2 Y3 Y4 Y5 YO1 YO2 YO3 YO4 O1 O2 O3 R1 R2 R3 R4 R5 R6 Bin Code V9 V10 V11 V12 555-558 558-561 561-564 564-567 567-570 570-573 573-576 582-585 585-588 588-591 591-594 594-597 597-600 600-603 603-606 606-609 609-612 612-615 615-618 618-621 621-624 624-627 627-630 630-633 633-636 VF (V) 3.2-3.4 3.4-3.6 3.6-3.8 3.8-4.0 Bin Code V13 V14 V15 V16 VF (V) 4.0-4.2 4.2-4.4 4.4-4.6 4.6-4.8
YELLOW GREEN
FORWARD VOLTAGE (VF) BIN
Page: 3
FLUX LED SPECIFICATION
Typical electrical/optical characteristic curves
Forward Current VS. Forward Voltage 2.5 Radiant Luminous Intensity Relative Value at IF=70mA 2.0 1.5 1.0 0.5 0 0 40 20 60 80 IF-Forward Current (mA) 100 Radiant Luminous Intensity VS. Forward Current
100 Forward Current(mA) 80 60 40 20 0 2.4
2.8 3.2 3.6 4.0 Forward Voltage(V)
2.4
Forward Current VS. Ambient Temperature 100 Forward Current(mA) Radiant Intensity 80 60 40 20 0 0 20 40 60 80
()
Radiant Luminous Intensity VS. Ambient Temperature 2.5 2.0 1.5 1.0 0.5 100 0 -30 30 50 70 -10 10 Ambient Temperature TA
( )
90
Ambient Temperature TA
Relative Luminous Intensity
100 75 50 25 0 400 450 550 500 600 Wavelength (nm) 650 700
Page: 4
LED
SOLDERING
METHOD
LAMP APPLICATION
SOLDERING CONDITIONS
REMARK Solder no closer than 3mm from the base of the package Using soldering flux," RESIN FLUX" is recommended.
DIP SOLDERING
Bath temperature: 2605 Immersion time: with 5 sec
During soldering, take care not to press the tip of iron against the Soldering iron: 30W or smaller lead. SOLDERING Temperature at tip of iron: 260 or lower (To prevent heat from being IRON Soldering time: within 5 sec. transferred directly to the lead, hold the lead with a pair of tweezers while soldering 1) When soldering the lead of LED in a condition that the package is fixed with a panel (See Fig.1), be careful not to stress the leads with iron tip.
Lead wries
Panel
(Fig.1)
2) When soldering wire to the lead, work with a Fig (See Fig.2) to avoid stressing the package.
Lead wries
Leave
a slight clearance
(Fig.2)
Page : 5
LED
LAMP APPLICATION
3) Similarly, when a jig is used to solder the LED to PC board, take care as much as possible to avoid steering the leads (See Fig.3).
PC board
F ig.3 jig
4) Repositioning after soldering should be avoided as much as possible. If inevitable, be sure to preserve the soldering conditions with irons stated above: select a best-suited method that assures the least stress to the LED. 5) Lead cutting after soldering should be performed only after the LED temperature has returned to normal temperature.
LED MOUNTING METHOD
1) When mounting the LED by using a case, as shown Fig.4, ensure that the mounting holds on the PC board match the pitch of the leads correctly-tolerance of dimensions of the respective components including the LED should be taken into account especially when designing the case, PC board, etc. to prevent pitch misalignment between the leads and board holes, the diameter of the board holes should be slightly larger than the size of the lead. Alternatively, the shape of the holes should be made oval. (See Fig.4)
case
pc board
Fig.4
Page : 6
LED
LAMP APPLICATION
2) Use LEDs with stand-off (Fig.5) or the tube or spacer made of resin (Fig.6) to position the LEDs.
Tube
Stand-off
Fig.5
Fig.6
FORMED LEAD
1) The lead should be bent at a point located at least 2mm away from the package. Bending should be performed with base fixed means of a jig or pliers (Fig.7)
Fig.7
2) Forming lead should be carried our prior to soldering and never during or after soldering. 3) Form the lead to ensure alignment between the leads and the hole on board, so that stress against the LED is prevented. (Fig.8)
2mm
Page : 7
LED
LEAD STRENGTH
LAMP APPLICATION
1) Bend strength Do not bend the lead more than twice. (Fig.9)
Fig.9
2) Tensile strength (@Room Temperature) If the force is 1kg or less, there will be no problem. (Fig.10)
OK
1Kg
Fig.10
HANDLING PRECAUTIONS
Although rigid against vibration, the LEDs may damaged or scratched if dropped. So take care when handling.
CHEMICAL RESISTANCE
1) Avoid exposure to chemicals as it may attack the LED surface and cause discoloration. 2) When washing is required, refer to the following table for the proper chemical to be sued. (Immersion time: within 3 minutes at room temperature.) SOLVENT Freon TE Chlorothene Isopropyl Alcohol Thinner Acetone Trichloroethylene --Usable ADAPTABILITY NOTE: Influences of ultrasonic cleaning of the LED resin body differ depending on such factors as the oscillator output, size of the PC board and the way in which the LED is mounted. Therefore, ultrasonic cleaning should only be performed after confirming there is no problem by conducting a test under practical.
--Do not use.
Page : 8
LED
LAMP PASSED TESTS
Experiment Item:
Item Test Condition
Lamp & IR Ta 255 IF= 20mA RH=60%RH DYNAMIC:100mA 1ms 1/10 duty STATIC STATE: IF20mA TEST TIME: 168HRS-24HRS+24HRS 500HRS-24HRS+24HRS 1000HRS-24HRS+72HRS Ta 655 RH 9095%RH TEST TIME240HRS2HRS 10525-5525 30min 5min 30min 5min 10CYCLES 1055-555 10min 10min 10CYCLES Reference Standard
OPERATION LIFE
MIL-STD-7501026 MIL-STD-8831005 JIS C 7021B-1
HIGH TEMPERATURE HIGH HUMIDITY STORAGE TEMPERATURE CYCLING
MIL-STD-202103B JIS C 7021 B-1
MIL-STD-202107D MIL-STD-7501051 MIL-STD-8831010 JIS C 7021 A-4 MIL-STD-202107D MIL-STD-7501051 MIL-SYD-8831011 MIL-STD-202210A MIL-STD-750-2031 JIS C 7021A-1 MIL-STD-202208D MIL-STD-7502026 MIL-STD-8832003 JIS C 7021 A-2
THERMAL SHOCK
SOLDER RESISTANCE
Tsol2605 DWELL TIME10lsec Tsol2305 DWELL TIME5lsec Circuit model B
SOLDERABILITY
Drive Method Circuit model A
Page : 9 (A)Recommended circuit. (B)The difference of brightness between LEDs could be found due to the Vf-If characteristics of LED.

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